By 2030, The Global Automotive SiC Substrate Applied For Power Module Market Will Increase by 1697%

November 25 news, with the rapid development of the market, driving the automotive Power Module (Power Module, PM) market expansion year by year, 2030 market size is estimated to explode 4.6 times, 2030 using silicon carbide (SiC) Power semiconductor market size is estimated to soar 17 times,Surpass si-PM market which uses silicon (Si) power semiconductor.

Homray Material Technology as the professional SiC Substrate manufacturer and supplier, we offers the best price on the market for high quality SiC substrate. The major products are 4 inch 6 inch silicon carbide SiC substrate, widely used in electronic devices with high power and high frequency, light emitting diode (LED) and other. light-emitting diode (LED) is the use of semiconductor electrons and holes in a combination of electronic components, is an energy-saving cold light source.
 
It is estimated that before 2025, with the introduction of 6-inch SiC Substrate into mass production, power semiconductor factory to discuss production technology progress, promote the reduction of SiC power semiconductor cost, drive the use of SIC-PM object will be expanded from high order electric vehicles to part of the medium order electric vehicles, and after 2026, considering the use of new electric vehicles sic-PM factory increase,It is estimated that the automotive SIC-PM market will enter the expansion period from 2026, and it is estimated that the market size of SIC-PM will surpass that of SI-PM in 2030.